Improvements in PCB innerlayer bonding technology

Alternatives to conventional oxides were introduced in the mid‐1990s as part of innerlayer bonding processes that were significantly less expensive than reduced oxides. This was due to their lower equipment costs, shorter cycle times, and lower chemistry costs. However, the first offerings of these processes forced printed circuit board suppliers to accept some performance compromises in the areas of waste treatment, filtration costs, process control, and peel strength.As chemical suppliers further refined their alternative oxide process chemistries, many of these deficiencies were overcome and a second generation was introduced. The second generation improvements have addressed the earlier deficiencies and present the so called “alternative oxides” as a cost effective, reliable process for innerlayer bonding.