Institute receives S.E.C. bonder for manufacturing classwork

Institute receives S.E.C. bonder for manufacturing classwork

Keyword: Bonding

Semiconductor Equipment Corporation has announced that the American Competitive Institute in Philadelphia, Pennsylvania is using one of S.E.C.'s Model 850 flip chip bonders as a teaching aid in the institute's summer 2001 SMT manufacturing course. Attending students from companies around the USA are receiving instruction in the basics of die attachment, with hands-on training through the use of the S.E.C. bonder.

The Model 850 attaches flip chips, chip scale devices and bare die and is designed for entry level low volume production and development projects requiring placement accuracies of b1 12gm.