Editorial board

Editor

Dr Chong Leong Gan Micron Technology Inc
- Taiwan
clgan@micron.com

Associate Editor

Dr Quah Jin Universiti Sains Malaysia
- Malaysia
hock_jin@usm.my

Publisher

Ben Ramster
Emerald Publishing - UK
bramster@emerald.com

Journal Editorial Office (For queries related to pre-acceptance)

Please contact the Journal Editorial Office
eng-ed-office.emerald@kwglobal.com

Supplier Project Manager (For queries related to post-acceptance)

Shivani Verma
Emerald Publishing
shivani.emerald@kwglobal.com

Editorial Advisory Board

Dr Jamil Akhtar
Institute for Innovations in Science and Technology - India

Assoc. Prof. Mariya Petrova Aleksandrova
Technical University of Sofia -

Bulgaria Dr Omar Bchir
Vice President of IC Package Engineering, Qualcomm - US - US

Professor Mitchai Chongcheawchamnan
Prince of Songkla University - Thailand

Professor Andrzej Dziedzic
Wroclaw University of Technology -

Poland Dr Chen-Yu Huang Micron Memory Taiwan Co. Ltd
- Taiwan

Dr Yangyang Lai Hardware Reliability Engineer, Google
- US

Professor Cristian Ariel Olguín Pinatti Universitat Politècnica de València
- Spain

Dr Lei Qiao Abbott Laboratories
- USA

Professor Hamid M. Sedighi
Shahid Chamran University of Ahvaz -

Iran Assoc. Prof. Kim S Siow Universiti Kebangsaan Malaysia
- Malaysia

Dr Agata Skwarek
Research Network Łukasiewicz - Institute of Microelectronics and Photonics -

Poland Dr Marios Sophocleous
University of Cyprus -

Cyprus Professor Ivan Szendiuch
Brno University of Technology -

Czech Republic Assoc. Prof Zhaoyang Zhao
Southwest Jiaotong University -

People's Republic of China Former Editor Professor John Karl Atkinson
University of Southampton - UK