Editorial board
Editor
Dr Chong Leong Gan
Micron Technology Inc - Taiwan
clgan@micron.com
Associate Editor
Dr Quah Jin
Universiti Sains Malaysia - Malaysia
hock_jin@usm.my
Publisher
Ben Ramster
Emerald Publishing - UK
bramster@emerald.com
Journal Editorial Office (For queries related to pre-acceptance)
Please contact the Journal Editorial Office
eng-ed-office.emerald@kwglobal.com
Supplier Project Manager (For queries related to post-acceptance)
Shivani Verma
Emerald Publishing
shivani.emerald@kwglobal.com
Editorial Advisory Board
Dr Jamil Akhtar
Institute for Innovations in Science and Technology - India
Assoc. Prof. Mariya Petrova Aleksandrova
Technical University of Sofia - Bulgaria
Dr Omar Bchir
Vice President of IC Package Engineering, Qualcomm - US - US
Professor Mitchai Chongcheawchamnan
Prince of Songkla University - Thailand
Professor Andrzej Dziedzic
Wroclaw University of Technology - Poland
Dr Chen-Yu Huang
Micron Memory Taiwan Co. Ltd - Taiwan
Dr Yangyang Lai
Hardware Reliability Engineer, Google - US
Professor Cristian Ariel Olguín Pinatti
Universitat Politècnica de València - Spain
Dr Lei Qiao
Abbott Laboratories - USA
Professor Hamid M. Sedighi
Shahid Chamran University of Ahvaz - Iran
Assoc. Prof. Kim S Siow
Universiti Kebangsaan Malaysia - Malaysia
Dr Agata Skwarek
Research Network Łukasiewicz - Institute of Microelectronics and Photonics - Poland
Dr Marios Sophocleous
University of Cyprus - Cyprus
Professor Ivan Szendiuch
Brno University of Technology - Czech Republic
Assoc. Prof Zhaoyang Zhao
Southwest Jiaotong University - People's Republic of China
Former Editor
Professor John Karl Atkinson
University of Southampton - UK
