Ethylene diamine tetra‐acetic acid (EDTA) and other chelates are widely employed in the electroless copper plating solutions and related chemistries used in printed circuit board (PCB) manufacturing. EDTA in particular, imparts many benefits to these processes but it is also becoming increasingly undesirable from an effluent treatment and environmental perspective. Consequently, there is a need to remove EDTA and similar compounds from effluent produced during the PCB manufacturing process. In this paper, the effectiveness of hydroxyl radicals, generated by a UV/ozone based enhanced oxidation process, in destroying relatively low levels of EDTA and other chelates has been evaluated. The influence of temperature, operating pH and chelate concentration has been investigated. Initial results indicate that a combined UV/ozone based process provides a useful and effective method for conveniently destroying EDTA, its hydroxy ethyl analogue and ethanolamine in aqueous solution.
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1 June 2003
Research Article|
June 01 2003
Evaluation of an enhanced oxidation method for the destruction of ethylene diamine tetra‐acetic acid (EDTA) and related compounds in aqueous solution Available to Purchase
Narinder Bains;
Narinder Bains
Shipley Europe Ltd, Coventry, UK
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Martin Goosey;
Martin Goosey
Shipley Europe Ltd, Coventry, UK
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Runveer Hayer
Runveer Hayer
Shipley Europe Ltd, Coventry, UK
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Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© MCB UP Limited
2003
Circuit World (2003) 29 (2): 15–19.
Citation
Bains N, Goosey M, Hayer R (2003), "Evaluation of an enhanced oxidation method for the destruction of ethylene diamine tetra‐acetic acid (EDTA) and related compounds in aqueous solution". Circuit World, Vol. 29 No. 2 pp. 15–19, doi: https://doi.org/10.1108/03056120310454952
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