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Polymer Electronics

Martin Goosey

Circuit World (2014) 40 (1)

https://doi.org/10.1108/CW-10-2013-0043

Published: 28 January 2014

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Journal Articles

Editorial

Martin Goosey

Circuit World (2013) 39 (4)

https://doi.org/10.1108/CW-08-2013-0028

Published: 18 November 2013

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Journal Articles

Book review

Martin Goosey

Circuit World (2013) 39 (3)

https://doi.org/10.1108/cw.2013.21739cae.001

Published: 16 August 2013

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Journal Articles

Editorial

Martin Goosey

Circuit World (2013) 39 (3)

https://doi.org/10.1108/cw.2013.21739caa.001

Published: 16 August 2013

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Journal Articles

6th International Symposium on Tin Whiskers

Martin Goosey

Circuit World (2013) 39 (2)

https://doi.org/10.1108/cw.2013.21739baa.015

Published: 10 May 2013

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Journal Articles

Large area electronics: addressing the applications challenge

Martin Goosey

Circuit World (2013) 39 (2)

https://doi.org/10.1108/cw.2013.21739baa.016

Published: 10 May 2013

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Journal Articles

Mesmoproc – implementation of a maskless electrochemical surface modification process

Martin Goosey, Sudipta Roy

Circuit World (2013) 39 (2)

https://doi.org/10.1108/cw.2013.21739baa.010

Published: 10 May 2013

View article titled, Mesmoproc – implementation of a maskless electrochemical surface modification process

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Journal Articles

Editorial

Martin Goosey

Circuit World (2013) 39 (2)

https://doi.org/10.1108/cw.2013.21739baa.001

Published: 10 May 2013

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Journal Articles

Dissemination Seminar: Results from Applied Research Projects in the Surface Engineering and Printed Circuit Sectors Surface Engineering Association, Federation House, Vyse Street, Birmingham 29 June 2012

Martin Goosey

Circuit World (2012) 38 (4)

https://doi.org/10.1108/cw.2012.21738daa.014

Published: 16 November 2012

View article titled, Dissemination Seminar: Results from Applied Research Projects in the Surface Engineering and Printed Circuit Sectors Surface Engineering Association, Federation House, Vyse Street, Birmingham 29 June 2012

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Journal Articles

Editorial

Martin Goosey

Circuit World (2012) 38 (4)

https://doi.org/10.1108/cw.2012.21738daa.001

Published: 16 November 2012

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Journal Articles

Editorial

Martin Goosey

Circuit World (2012) 38 (3)

https://doi.org/10.1108/cw.2012.21738caa.001

Published: 17 August 2012

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Journal Articles

3D Packaging Seminar TWI, Granta Park, Abington, Cambridge – 23 May 2012

Martin Goosey

Circuit World (2012) 38 (3)

https://doi.org/10.1108/cw.2012.21738caa.019

Published: 17 August 2012

View article titled, 3D Packaging Seminar TWI, Granta Park, Abington, Cambridge – 23 May 2012

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Journal Articles

New R&D funding support announced by the UKs Innovative electronics Manufacturing Research Centre (IeMRC)

Martin Goosey

Circuit World (2012) 38 (2)

https://doi.org/10.1108/cw.2012.21738baa.002

Published: 11 May 2012

View article titled, New R&D funding support announced by the UKs Innovative electronics Manufacturing Research Centre (IeMRC)

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Journal Articles

A short introduction to graphene and its potential interconnect applications

Martin Goosey

Circuit World (2012) 38 (2): 83–86.

https://doi.org/10.1108/03056121211222309

Published: 11 May 2012

View article titled, A short introduction to graphene and its potential interconnect applications

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Journal Articles

Advanced surface protection for improved reliability PCB systems (ASPIS)

Andy Ballantyne, Greg Forrest, Martin Goosey, Asta Griguceviciene, Jurga Juodkazyte, Rod Kellner, Aleksandr Kosenko, Rimantas Ramanauskas, Karl Ryder, Algirdas Selskis, Rima Tarozaite, Erik Veninga

Circuit World (2012) 38 (1): 21–29.

https://doi.org/10.1108/03056121211195021

Published: 03 February 2012

View article titled, Advanced surface protection for improved reliability PCB systems (ASPIS)

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Journal Articles

Recovery of copper from PCB manufacturing effluent using chitin and chitosan

Martin Goosey, Rod Kellner

Circuit World (2012) 38 (1): 16–20.

https://doi.org/10.1108/03056121211195012

Published: 03 February 2012

View article titled, Recovery of copper from PCB manufacturing effluent using chitin and chitosan

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Journal Articles

Susonence – a new multi-partner project developing advanced sonochemical processes to reduce chemical usage and decrease waste in the PCB and metal finishing industries

Martin Goosey

Circuit World (2012) 38 (1)

https://doi.org/10.1108/cw.2012.21738aaa.002

Published: 03 February 2012

View article titled, Susonence – a new multi-partner project developing advanced sonochemical processes to reduce chemical usage and decrease waste in the PCB and metal finishing industries

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Journal Articles

Editorial

Martin Goosey

Circuit World (2012) 38 (1)

https://doi.org/10.1108/cw.2012.21738aaa.001

Published: 03 February 2012

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Journal Articles

IC package innovation: choosing the right solution TWI, Granta Park, Abington, Cambridge, 26 May 2011

Martin Goosey

Circuit World (2011) 37 (4)

https://doi.org/10.1108/cw.2011.21737dab.015

Published: 22 November 2011

View article titled, IC package innovation: choosing the right solution TWI, Granta Park, Abington, Cambridge, 26 May 2011

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Journal Articles

Editorial

Martin Goosey

Circuit World (2011) 37 (3)

https://doi.org/10.1108/cw.2011.21737caa.001

Published: 23 August 2011

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Polymer Electronics

Editorial

Book review

Editorial

6th International Symposium on Tin Whiskers

Large area electronics: addressing the applications challenge

Mesmoproc – implementation of a maskless electrochemical surface modification process

Editorial

Dissemination Seminar: Results from Applied Research Projects in the Surface Engineering and Printed Circuit Sectors Surface Engineering Association, Federation House, Vyse Street, Birmingham 29 June 2012

Editorial

Editorial

3D Packaging Seminar TWI, Granta Park, Abington, Cambridge – 23 May 2012

New R&D funding support announced by the UKs Innovative electronics Manufacturing Research Centre (IeMRC)

A short introduction to graphene and its potential interconnect applications

Advanced surface protection for improved reliability PCB systems (ASPIS)

Recovery of copper from PCB manufacturing effluent using chitin and chitosan

Susonence – a new multi-partner project developing advanced sonochemical processes to reduce chemical usage and decrease waste in the PCB and metal finishing industries

Editorial

IC package innovation: choosing the right solution TWI, Granta Park, Abington, Cambridge, 26 May 2011

Editorial

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