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Volume 3, Issue 2
1 January 1977
Circuit World Cover Image for Volume 3, Issue 2
Review Article| January 01 1977

Troubleshooting in the Electroless Copper Process Available to Purchase

Frank E. Stone
Frank E. Stone
Enthone Inc, Newhaven, Conn., USA.
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© MCB UP Limited
1977
Circuit World (1977) 3 (2): 14–15.
https://doi.org/10.1108/eb043551

In this paper, reproduced by permission of the Institute of Printed Circuits (USA), the author discusses the factors which can affect the quality and adhesion of electroless copper plating on printed circuit boards and recommends procedures to ensure optimum results.

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© MCB UP Limited
1977
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