The purpose of this paper is to present a better understanding of nickel corrosion, also known as “black pad” during gold deposition of EN1G.
This paper presents an accumulation of personal experience and observations of the problem over a period of ten years. It incorporates the experience of the Global Trade Association connecting the electronic industries (IPC) plating committee as it set out to write the IPC electroless nickel‐immersion gold (ENIG) specification‐4552.
Understanding how corrosion occurs will go a long way in helping printed circuit board (PCB) manufacturers stay clear of the issue and make high quality ENIG finished PCBs.
The majority of the data presented has been substantiated.
The paper details how, by good understanding of the mechanism of formation of corrosion products, manufacturers can steer clear from the problem.
