Issues

Appointments

Chairman of AT&S Management Board to stand down

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Book review

Printed Circuits Handbook

Martin Goosey
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Energy conservation and related best practices in printed circuit board (PCB) manufacturing

Martin Goosey; Rod Kellner
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Is “black pad” still an issue for ENIG?

George Milad
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Pilot trials of immersion silver deposition using a choline chloride based ionic liquid

Emma L. Smith; Andrew P. Abbott; Jason Griffin; Robert C. Harris; Cecil O'Connor; Karl S. Ryder
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Inner‐layer copper reliability of electroless copper processes

Crystal P.L. Li; Paul Ciccolo; Dennis K.W. Yee
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OrmeSTAR Ultra – the organic metal nanofinish

B. Wessling; M. Rischka; J. Posdorfer
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Effectiveness of embedded capacitors in reducing the number of surface mount capacitors for decoupling applications

Mohammed A. Alam; Michael H. Azarian; Michael Osterman; Michael Pecht
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Conferences and exhibitions

Innovative Electronics Manufacturing Research Centre 4th Annual Conference, Loughborough, UK2 September 2009

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International Electronics Forum, Geneva, Switzerland 1 and 2 October 2009

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Institute of Circuit Technology, Arundel Evening Seminar 6 October 2009

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Industry news

Viasystems and Merix to merge

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Major North American expansion unveiled by Teknek

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IPC-2152 – Standard for Determining Current-Carrying Capacity in Printed Board Design released

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International diary

International diary

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New products

Pressurex® promotes uniform nip pressure distribution to reduce dry film resist lamination defects

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NucleuS™ production technology boosting efficiency of volume production of printed circuit boards and cutting costs

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Note from the publisher

Measuring the impact of research

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