The purpose of this paper is to detail an innovative new equipment enhancement for use in the horizontal processing of printed circuit boards (PCBs).
The paper describes a non‐contact laminar or streamline flow process chamber. It also describes a transport and guiding method suitable for both thick and thin materials and expands on the mechanics and fluid dynamics that further reduce equipment length and operating cost.
The new process chamber and its related enhancements result in a faster and more uniform chemical reaction than is obtainable with conventional flood chambers. This enables the equipment to have reduced length and to offer reduced operating costs.
The paper presents a new approach to horizontal processing that can offer reduced equipment footprints and reductions in operating costs.
