Mass Lamination as a Laminator's Service to the PCB Industry

This paper describes the principles of mass lamination as applied to the production of multilayer printed wiring boards. Recent development of the service is briefly discussed, highlighting the ways it can reduce costs and investment required to produce in large volume. A description of the process follows, providing an indication of the scope and nature of inner layer preparation, up to the final bonding stage. Reference is also made to the method used of location for drilling and finishing operations.