Probot Inc. will exhibit new non-contact electrical tester for HDI chip carrier substrates

Probot Inc. will exhibit new non-contact electrical tester for HDI chip carrier substrates

Keywords Probes, Probot, Testing

At the IPC Printed Circuits Expo, 16-19 March 1999, Probot will exhibit its line of moving probe test systems and new non-contact Flash Probe tester for chip carrier substrates.

Probot is better known for high-end fixtureless moving probe test systems. Their new line of non-contact testers represents an expansion for the company into higher volume testing for products with the smallest geometry test points and highest densities.

The flash probe (Plate 3)measures an AC signal that is injected into each net to test continuity. The tester functions without touching the smallest, most delicate pads. An electromagnetic wave radiates from the fine pitch bonding pads, which is detected by a non-contact sensor. There are no pins or rubber to damage or contaminate the pads, and fixturing is simple and low cost. The non-contact method produces highly reliable test results and is extremely fast, making it ideal for testing production volumes of the most advanced ship-scale products­ including film-based versions, ball grid arrays, mini and super BGAs in single and multichip formats.

 Plate 3 Flash probe

For further information please contact Randy Allinson on +1 (203) 481 4764.