Polyclad Laminates and Rexam announce agreement

Polyclad Laminates and Rexam announce agreement

Keywords: Polyclad, Rexam

Polyclad Laminates, Inc. and Rexam CFP Limited have signed a global agreement to supply the electronics market with resin-coated copper foil for use in the manufacture of printed wiring boards. The agreement was signed on 19 July 2001.

Under the terms of the agreement, Rexam will be the exclusive manufacturer of Polyclad Laminates' high performance resin-coated copper foils used to build microvia multilayers in high density interconnect PWBs. Both companies will continue to build a strong, mutually beneficial partnership that may also include future co-development of resin-coated products. This agreement formalizes an ongoing business relationship the companies have valued over the last two years.