Feinfocus' system handles large boards
Feinfocus' system handles large boards
Keywords: Feinfocus, Handling
Feinfocus Röntgen-Systeme GmbH has introduced an additional feature to its FXS-160.40 (T.I.G.E.R.) system enabling oversized board- handling capabilities.
An increased need for larger scanning areas by the telecommunications switching, embedded back plane, and other large board manufacturers, led the company to develop an optional 240–240 (610–610 mm) sample tray. This unique feature enables complete and thorough oblique angle view inspection of large board samples. This innovation also presents a great benefit to users with production environment applications, in which the larger inspection area allows a greater number of smaller components to be inspected at a single time(Plate 1).
Originally designed for the rigorous demands of the PCB assembly industry,the T.I.G.E.R. is optimal for the efficient and effective inspection of component devices such as ball grid arrays, solder interconnects, hybrid components, and other encapsulated electromechanical components.
Plate 1The T.I.G.E.R
The T.I.G.E.R. system features geometric magnifications of up to 636-fold and total magnifications up to 2,800-fold; as well as feinfocus' proprietary AIM technology which keeps the region of interest (ROI) clear and within the field of view at any level of magnification and tilt or rotation angle with no readjusting of the sample. Once the user chooses the sample's coarse position,AIM allows the system to automatically adjust, keeping the ROI in view. This function is especially powerful combined with other system features: the image intensifier's ability to rotate to a full 360°, tilt up to 60°, and move simultaneously with the sample table; as well as its ability to obtain oblique views and a glimpse into the 3rd dimension at any angle by stopping the high-precision manipulator at any degree point on the axis.
For further information, visit www.feinfocus.com
