Issues

Appointments

Dr Chen Xu appointed Senior Scientist, Enthone Inc.

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Edward Kudrak appointed Materials Laboratory Manager, Enthone Inc.

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Association news

IPC Printed Circuits Expo®

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Recycling technologies for the treatment of end of life printed circuit boards (PCBs)

Martin Goosey; Rod Kellner
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Soldermask laser direct imaging – an enabling technology

David Albin; Brewster Barclay
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A novel process for the manufacturing of advanced interconnects

R. Mosses; S. Brackenridge
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The relationship between self‐annealing of plated copper and copper surface treatment

Toshiko Nakagawa
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Sophisticated HDI flexible substrates for advanced applications

M. Stampanoni
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A three‐dimensional transmission line matrix (TLM) simulation method for thermal effects in high power insulated gate bipolar transistors

R. Hocine; D. Lim; S.H. Pulko; M.A. Boudghene Stambouli; A. Saidane
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Editorial

Editorial

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Exhibitions and conferences

SMART Conference Overview

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Industry news

New benefits for joining SSTC include lead-free document download facility

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AT&S to start production in China plant in Spring 2003

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Valor restructures to improve profit

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Vogt Electronic cuts 700 jobs in Germany

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Polyclad Laminates announces expansion of Elk Grove, California operation

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DDi Europe acquires Kamtronics

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Lead-free assemblies present no problems for automatic optical inspection

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Intellect comment

"Know How Driven Services"

Frank Coultard
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International diary

International diary

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Internet commentary

Internet commentary

Brian Ellis
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New products

DOCTAR compares two PCB designs and reports design differences

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Stacked vias technology

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DDi Europe introduces Flat-Pad technology

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Feinfocus' system handles large boards

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Polyclad introduces polyimide laminate and prepreg systems

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