Stacked vias technology

Stacked vias technology

To support the Flat-Pad methodology DDi Europe is also developing a filled via solution which is a screen printed (DDi Flat-Fill process) or plated process(DDi Flat-Plate process) that does not require any design modifications. Furthermore, the implementation of stacked vias technology, when combined with Flat-Pad, results in the additional reduction of real estate and increase in board density.

For further information, contact john.calvert@eu.diglobal.co.uk