EIPC Winter Conference Free

EIPC Winter Conference, Cannes 12-13 February 2004

How to Adapt to the Changes in Markets, Environment and Technologies?

EIPC Winter Conference

The European Institute of Printed Circuits (EIPC)is extending an invitation to companies and individuals active in the Packaging and Interconnection Industry to submit abstracts for presentations at the EIPC Winter Conference to be held on 12 and 13 February 2004 in Cannes, France.

The purpose of the winter Conference is to provide a platform for speakers and delegates to exchange information on the current market conditions, future innovation on interconnection and packaging as well as assembly of electronic and opto-electronic circuits. Delegates and visitors from throughout Europe will attend this event, offering presenters the opportunity to reach a targeted audience of decision makers and leaders of the international packaging and interconnection industry.

Deadlines: Mail your abstract to: E-mail: winter@eipc.org

• 1 page Abstract – 3 October 2003

• Notification of Acceptance – 15 October 2003

Why Cannes?

If you are searching for a place in Europe that is about as far removed from the cold and the rain, the sleet and the snow that the month of February usually offers, then Cannes is about as good as it gets. It has an exceptionally mild climate throughout the year, and each season has its own particular characteristic. Cannes is famed for its beautiful light, and the ancient area of"Le Suquet", with its narrow streets overlooking the old port, is a living reminder of days gone by when Cannes was a small fishing community. Cannes is more than just the place to host the famous Film Festival. It is a festival in itself, and an attractive venue for the EIPC to hold their conference. Connections by road, rail and air are excellent from anywhere in Europe.

Winter Conference Cannes at a glance

The conference will be held on 12 and 13 February in one of the numerous excellent conference facilities Cannes has to offer. The venue is The Radisson SAS Hotel.

Abstracts for presentations in the following areas are invited:

• 1.

  Marketing and management related subjects

  • Market circumstances and trends

  • The markets for telecommunications and cellular design

  • The automotive market

  • Supply chain management/logistics

  • E-commerce, Internet

  • Market trends

  • Globalisation-strategies and alliances

  • Quality management

  • Contract assembly or electronic manufacturing services (EMS)

  • Success strategies for small to medium sized companies

  • Any additional subjects on this topic appropriate to the conference technology

• 2.

  Technology related subjects

  • Packaging and applications

  • Opto-electronic circuits and packaging

  • Multi-chip-module (MCM) technology

  • Interconnection and packaging design

  • DFM/computer integrated manufacturing

  • Laminates and dielectric materials

  • Semiconductor devices and packaging technology

  • Production technologies

  • Assembly technologies

  • Manufacturing equipment and automation

  • Surface finish and solder mask

  • Electrical/functional testing

  • Inspection technology (visual and automated optical inspection)

  • Quality and reliability

  • Integrated components

  • High density interconnects (HDI)

  • Flip chip and area array

  • Any additional subjects on this topic appropriate to the conference>

• 3.

  Environmental subjects

  • Lead-free Materials and processes

  • Halogen-free laminate and dielectrics

  • ISO certification

  • Waste reduction/waste treatment/recycling technologies

  • Green technologies

  • Any additional subjects on this topic appropriate to the conference