New DuPont Zytel® HTN resins smooth the path to lead-free circuit assembly
New DuPont™ Zytel® HTN resins smooth the path to lead-free circuit assembly
Keywords: Printed circuits
To meet growing demand for electronic components that can withstand the higher temperatures required for board assembly with lead-free solders, DuPont scientists have developed the new LX series of DuPonte Zytel® HTN high performance polyamide.
“Connectors and other parts moulded from Zytel® HTNLX deliver outstanding performance in surface- mount reflow processes using lead-free solder”, said David Glasscock, America's Business Manager for High Temperature Solutions at DuPont Engineering Polymers. Operating temperatures with lead-free solder are typically in the 250-260°C range,about 20-30° higher than those employed with conventional lead-containing solder.
“During assembly at these higher temperatures and during moulding,Zytel® HTNLX delivers valuable advantages over several alternative polymers”, Glasscock added. Among them:
Faster line speeds. Zytel® HTNLX withstands higher peak reflow temperatures than PA46 and other similar PA6T polymer grades. Higher temperatures result in faster solder melting, thus enabling increased line speed.
Less part breakage. Test data using actual connectors show more toughness for Zytel® HTNLX than PA9T and PPS polymer grades and greater weld line strength than PA9T, PPS and another PA6T. Increased toughness pays off with reduced damage of parts and assembled circuits during shipping,handling and service.
Water-controlled moulds. Moulders can avoid the drawbacks of oil temperature control with Zytel® HTNLX. Unlike PA9T and another PA6T, it can produce fully crystallised parts when moulded in water-controlled tooling.
Faster moulding, more design freedom. During moulding, Zytel®HTNLX flows more easily than PA9T and other PA6T grades. Better flow can allow faster moulding cycles, lower injection pressure, and successful moulding of parts with thinner walls and/or longer flow paths.
Several electronic manufacturers in Asia are already profiting from the use of Zytel® HTNLX. In a connector for subscriber identity module(SIM) cards in mobile phones, for example, Wooyoung Company Ltd of Korea is benefiting from its resistance to higher reflow temperatures and its excellent dimensional stability, toughness and strength. Commercial applications at other manufacturers include surface- mount switches and I/O (input/output) connectors.
New LX series resins are glass- reinforced flame-retardant materials with a V-0 classification under the UL94 standard. Grades with glass- fibre content of 20, 30 and 45 percent are available.
For further information, visit the web site: www.dupont.com
