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Issue
1 January - Volume 10, Issue 2, Pages 4 - 56
1 February - Volume 10, Issue 3, Pages 4 - 76
1 March - Volume 10, Issue 4, Pages 4 - 70
1 April - Volume 11, Issue 1, Pages 4 - 85
Volume 11, Issue 1
1 April 1984
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ISSN
0305-6120
EISSN
1758-602X
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Creep and Fatigue Testing of Micro Solder Joints
G. Becker
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for Creep and Fatigue Testing of Micro Solder Joints
Some Metallurgical Studies Related to the Surface Mounting of Electronic Components
C.J. Thwaites
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for Some Metallurgical Studies Related to the Surface Mounting of Electronic Components
Laser Drilling of Printed Circuit Boards
M.N. Watson
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Machining Multilayer Circuit Boards
:
Part 2
J.K. Hagge
;
J.C. Mather
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for Machining Multilayer Circuit Boards<span class="subtitle-colon">: </span><span class="subtitle">Part 2</span>
Reflections on My Life as an Inventor
:
Part 1
P. Eisler
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for Reflections on My Life as an Inventor<span class="subtitle-colon">: </span><span class="subtitle">Part 1</span>
Chemical Copper Plating in the Additive Process
H‐J Ehrich
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Automatic Optical Inspection of Printed Circuit Boards
K.G. Doyle
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Economic Solvent Drying for Electronics Applications
W. Lambert
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Metallographic Examination of Solder Joints on Surface‐mounted Components
H. Steen
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for Metallographic Examination of Solder Joints on Surface‐mounted Components
Printed Circuit World Convention III Report
H.G. Manfield
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ICT News
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