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Issue
1 January - Volume 15, Issue 2, Pages 4 - 68
1 February - Volume 15, Issue 3, Pages 5 - 97
1 March - Volume 15, Issue 4, Pages 5 - 79
1 April - Volume 16, Issue 1, Pages 4 - 99
Volume 15, Issue 4
1 March 1989
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ISSN
0305-6120
EISSN
1758-602X
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Multilayer Circuit Boards with Molybdenum‐copper Metal Cores
R. Klemencic
;
E. Kny
;
W. Schmidt
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for Multilayer Circuit Boards with Molybdenum‐copper Metal Cores
Determination of Thermal Stress Resistance of Copper Electroplate by Hot Rupture Tests
L. Zakraysek
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for Determination of Thermal Stress Resistance of Copper Electroplate by Hot Rupture Tests
Base Materials with Predetermined Technological Properties for Advanced PCB Production Processes
M.B. Borisov
;
N.D. Belkin
;
A.I. Toushinsky
;
V.M. Evzhenko
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for Base Materials with Predetermined Technological Properties for Advanced PCB Production Processes
Tin‐lead Composition—Its Control and Effect on Solderability
D.A. Luke
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High Performance Laminate Systems for High Speed Electronics Applications
J.R. Paulus
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for High Performance Laminate Systems for High Speed Electronics Applications
Wave Soldering Concerns for Surface Mount Assemblies
D.A. Elliott
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for Wave Soldering Concerns for Surface Mount Assemblies
Residue on Printed Wiring Assemblies: An Overview and a Case History
J.B. Dunaway
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for Residue on Printed Wiring Assemblies: An Overview and a Case History
Improved Printed Circuit Reliability by Risk Site Analysis
F.W. Haining
;
R.F. Shaul
;
R.W. Keim
;
R.M. Murcko
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for Improved Printed Circuit Reliability by Risk Site Analysis
Interrelating Surface Insulation Resistance Test Patterns
A.S.L. Chan
;
T.A. Shankoff
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Vibratory Agitation to Enhance Mass Transfer in Electrodeposition
M.R. Kalantary
;
S.A. Amadi
;
D.R. Gabe
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for Vibratory Agitation to Enhance Mass Transfer in Electrodeposition
Erratum
C. Lea
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Depression Approaching from the Atlantic
Roger L. Tyler
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Kam Printronics Circuits—Joint Venture
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Internepcon UK, 1989
Lorna Cullen
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PCIF News
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International institute news
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