Issues

Book Review

Smart Electronic Materials: Fundamentals and Applications

Brian Ellis
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Integrated inductors on liquid crystal polymer substrate for RF applications

Gang Zou; Hans Grönqvist; Johan Liu
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Open trace defects in FR4 printed circuit boards

Sanka Ganesan; Michael Pecht
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A new fine‐grained matte pure tin for semiconductor lead‐frame applications

Keith Whitlaw; Jeff Crosby; Mike Toben
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Direct immersion gold (DIG) as a final finish

Shigeo Hashimoto; Masayuki Kiso; Yukinori Oda; Horoshi Otake; George Milad; Don Gudaczauskas
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Characterization of organic multi‐mode optical waveguides for electro‐optical printed circuit boards (EOPCB)

Li‐Cheng Shen; Wei‐Chung Lo; Hsiang‐Hung Chang; Huan‐Chun Fu; Yuan‐Chang Lee; Yu‐Chih Chen; Shu‐Ming Chang; Wun‐Yan Chen; Ming‐Chieh Chou
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High frequency conductor loss impact of oxide and oxide alternative processes

Gary Brist; Don Cullen
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Diary

Diary

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Exhibitions and conferences

Institute of Circuit Technology Annual Symposium 2005

Pete Starkey
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Intellect Technical Workshop, Coventry, 23 June 2005

Pete Starkey
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EIPC Summer Conference Stockholm June 9th and 10th 2005

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JPCA 2005

John Ling
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Industry news

Polyclad laminates publishes lead-free material selection guide

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EPPIC takes scoping opportunity in China

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IPC's SPVC answers the million dollar question: what's industry's best lead free solder?

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European network for WEEE compliance

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Stevenage Circuits and Tru-lon Printed Circuits purchase Spiron™ AOI systems from Orbotech

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QinetiQ to research feasibility of printing complete electronic circuits

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Intellect commentary

Components and manufacturing sector “Consolidation”

Frank Coultard
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Internet commentary

Internet commentary

Brian Ellis
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Report

Circatex first anniversary

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