Issues

Awards

Emerald ex-editor honoured by UN and USA

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Methods for dissipating heat from RF circuit boards

Markus Wille
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The process and pastes for the via hole plugging of HDI PCBs

Manfred Suppa
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A review of liquid crystal display technologies, electronic interconnection and failure analysis

C.A. Smith
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Nano‐ and micro‐filled conducting adhesives for z‐axis interconnections: new direction for high‐speed, high‐density, organic microelectronics packaging

Rabindra N. Das; Frank D. Egitto; Voya R. Markovich
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“Green” PCB production processes

Sven Lamprecht; Günter Heinz; Neil Patton; Stephen Kenny; Patrick Brooks
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Exhibitions and conferences

NPL's Chris Hunt picks up two awards at inaugural IPC Midwest Conference

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Productronica 2007

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National electronics week

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Snapshots

J.H. Ling
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Industry news

10,000 tonnes of WEEE waste recycled

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FBDI: REACH chemicals regulation also affects distribution

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PCBs may see shortages in 2008 as capacity expansion stalled by China environmental rules

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Appendix

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Rohm and Haas Company and SKC Launch “SKC Haas Display Films”

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Consumers put at risk by Greenpeace Campaign

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Ramaer install PAL

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New training facility for electronics companies in north and east of region

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New products

Automa-Tech-ORC imaging introduce “Acura-BGA”

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Frontline launches InPlan™ Flex engineering system for flex and rigid-flex manufacturers

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Proven technology – Automa-Tech-ORC imaging demo centre

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