Issues

Thermal-stress analysis and calculation of single and dual chip set double-sided circuit board based on three-dimensional finite element algorithm

Lan Song; Yang Zhao; Yaoming Zhou; Haifei Xiang
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Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability

Yuanming Chen; Shouxu Wang; Xuemei He; Wei He; Vadim V. Silberschmidt; Ze Tan
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Investigation of chip formation and burr control in PCB fixture hole

Lixin Huang
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Correlation analysis of wettability, intermetallic compound formation and PCB contamination

Frantisek Steiner; Karel Rendl; Vaclav Wirth
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Influence of the cavities on the PCB mechanical properties

Boleslav Psota; Alexandr Otáhal; Ivan Szendiuch
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Printed electrodes for flexible, light-weight solid-state supercapacitors – a feasibility study

Jagdeep S. Sagu; Nicola York; Darren Southee; K.G.U. Wijayantha
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Mechanical drilling of PCB micro hole and its application in micro ultrasonic powder molding

Xiong Liang; Bing Li; Lianyu Fu; Xiaoyu Wu; Hongyan Shi; Taijiang Peng; Bin Xu
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