Issues

Special Issue: IMAPS 2018. Guest Editor: Agata Skwarek

Guest editorial

Agata Skwarek
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Joints realized by sintering of pressureless Ag paste

Alena Pietrikova; Tomas Girasek; Lubomir Livovsky; Juraj Durisin; Karel Saksl
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Photonic curing of silver paths on 3D printed polymer substrate

Jakub Krzeminski; Bartosz Blicharz; Andrzej Skalski; Grzegorz Wroblewski; Małgorzata Jakubowska; Marcin Sloma
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Investigation of inkjet printed path resistance in the context of manufacture and flexible application

Grzegorz Tomaszewski; Jerzy Potencki; Grzegorz Błąd; Tadeusz Wałach; Grzegorz Gajór; Alena Pietrikova; Peter Lukacs
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Electrical and rheological percolation threshold of graphene pastes for screen-printing

Lucja Dybowska-Sarapuk; Daniel Janczak; Bartlomiej Podsiadly; Malgorzata Jakubowska; Marcin Sloma
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Piezoresistive effect in embedded thick-film resistors

Janusz Borecki; Aneta Araźna; Kamil Janeczek; Jerzy Kalenik; Michał Kalenik; Wojciech Stęplewski; Rafał Tarakowski
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Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs

Dániel Straubinger; Attila Géczy; András Sipos; András Kiss; Dániel Gyarmati; Oliver Krammer; Dániel Rigler; David Bušek; Gábor Harsányi
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Signal integrity in microelectronic hybrid systems made on metal substrates

Dariusz Klepacki; Wieslaw Sabat; Kazimierz Kamuda; Kazimierz Kurylo
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