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Issue
1 January - Volume 8, Issue 2, Pages 8 - 56
1 February - Volume 8, Issue 3, Pages 4 - 28
1 March - Volume 8, Issue 4, Pages 8 - 40
1 April - Volume 9, Issue 1, Pages 4 - 48
Volume 9, Issue 1
1 April 1982
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ISSN
0305-6120
EISSN
1758-602X
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Clad Metal Circuit Board Substrates for Direct Mounting of Ceramic Chip Carriers
Francis J. Dance
;
John L. Wallace
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titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
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Epoxy Prepreg Characterisation Using Scaled Flow Testing Techniques
D.P. Bloechle
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Circuit World Visits Schering Chemicals
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Round the Circuit
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Crystal balls
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Institute News
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The Printed Circuit Challenges of the '80s
R. Mettler
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Thermal Implications of Using Chip Carriers with Current Laminates
P. Gregory
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