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Journal Articles

Morphology and Stability of Electrochemically Generated Copper Layers: The Effect of Electron Transfer and Nucleation Kinetics

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M. Wünsche, H. Meyer, R. Schumacher
Journal: Circuit World
Circuit World (1996) 22 (3): 4–9.
https://doi.org/10.1108/03056129610800036
Published: 01 December 1996
View article titled, Morphology and Stability of Electrochemically Generated Copper Layers: The Effect of Electron Transfer and Nucleation Kinetics
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Journal Articles

The Production and Through‐hole Plating of Modern Base Materials

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Th. Haug, P. Magnani, B. Bressel, H.‐J. Grapentin, H. Meyer
Journal: Circuit World
Circuit World (1989) 15 (3): 9–13.
https://doi.org/10.1108/eb043982
Published: 01 February 1989
View article titled, The Production and Through‐hole Plating of Modern Base Materials
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