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Journal Articles

Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip

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J.H. Lau
Journal: Circuit World
Circuit World (1997) 23 (4): 22–25.
https://doi.org/10.1108/03056129710370277
Published: 01 December 1997
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Journal Articles

Design for Plastic Ball Grid Array Solder Joint Reliability

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S.‐W.R. Lee, J.H. Lau
Journal: Circuit World
Circuit World (1997) 23 (2): 11–13.
https://doi.org/10.1108/03056129710370132
Published: 01 June 1997
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Journal Articles

Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Packages

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S.‐W. Lee, J.H. Lau
Journal: Circuit World
Circuit World (1997) 23 (1): 16–19.
https://doi.org/10.1108/03056129710800080
Published: 01 March 1997
View article titled, Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Packages
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Journal Articles

Overview of Tape Automated Bonding Technology

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J.H. Lau, S.J. Erasmus, D.W. Rice
Journal: Circuit World
Circuit World (1990) 16 (2): 5–24.
https://doi.org/10.1108/eb044017
Published: 01 January 1990
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