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Journal Articles

Manufacture of an aluminum rigid‐flex circuit assembly without the use of solder

Joseph Fjelstad

Circuit World (2013) 39 (1): 4–8.

https://doi.org/10.1108/03056121311298891

Published: 01 February 2013

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Journal Articles

Putting 3D interconnection technologies into perspective from chip to system

Joseph Fjelstad

Circuit World (2012) 38 (1): 4–11.

https://doi.org/10.1108/03056121211194996

Published: 03 February 2012

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Journal Articles

Flexible circuit materials

Joseph Fjelstad

Circuit World (2008) 34 (4): 19–24.

https://doi.org/10.1108/03056120810918088

Published: 21 November 2008

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Journal Articles

Environmentally friendly assembly of robust electronics without solder

Joseph Fjelstad

Circuit World (2008) 34 (2): 27–33.

https://doi.org/10.1108/03056120810874555

Published: 16 May 2008

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Journal Articles

3D PCB architecture for next generation high speed interconnections

Joseph Fjelstad, Kevin Grundy, Gary Yasumura

Circuit World (2005) 31 (4): 25–33.

https://doi.org/10.1108/03056120510603116

Published: 01 December 2005

View article titled, 3D PCB architecture for next generation high speed interconnections

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Journal Articles

Interconnection strategies for high‐density printed circuits – an overview

Joseph Fjelstad

Circuit World (2002) 28 (1): 6–9.

https://doi.org/10.1108/03056120210407685

Published: 01 March 2002

View article titled, Interconnection strategies for high‐density printed circuits – an overview

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Journal Articles

Manufacture of high density interconnection substrates by co‐lamination of inner layers and programmed interconnection joining layers

Joseph Fjelstad, Konstantine Karavakis, Belgacem Haba

Circuit World (1999) 25 (3): 9–12.

https://doi.org/10.1108/03056129910268927

Published: 01 September 1999

View article titled, Manufacture of high density interconnection substrates by co‐lamination of inner layers and programmed interconnection joining layers

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Journal Articles

Flexible circuitry ‐ technology background and important fundamental issues

Joseph Fjelstad

Circuit World (1999) 25 (2): 6–10.

https://doi.org/10.1108/03056129910258207

Published: 01 June 1999

View article titled, Flexible circuitry ‐ technology background and important fundamental issues

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Manufacture of an aluminum rigid‐flex circuit assembly without the use of solder

Putting 3D interconnection technologies into perspective from chip to system

Flexible circuit materials

Environmentally friendly assembly of robust electronics without solder

3D PCB architecture for next generation high speed interconnections

Interconnection strategies for high‐density printed circuits – an overview

Manufacture of high density interconnection substrates by co‐lamination of inner layers and programmed interconnection joining layers

Flexible circuitry ‐ technology background and important fundamental issues

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