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Journal Articles

Hybrid modeling of woven fibre reinforced metal matrix composite for multilayer circuit boards

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K.H. Low, Yuqi Wang
Journal: Circuit World
Circuit World (2008) 34 (2): 12–20.
https://doi.org/10.1108/03056120810874537
Published: 16 May 2008
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Journal Articles

Modeling of multi‐layer circuit boards by using a model of bi‐phase and elasto‐plastic plies

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K.H. Low, Yuqi Wang
Journal: Circuit World
Circuit World (2007) 33 (3): 9–20.
https://doi.org/10.1108/03056120710776979
Published: 28 August 2007
View article titled, Modeling of multi‐layer circuit boards by using a model of bi‐phase and elasto‐plastic plies
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