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Journal Articles

New epoxy resins for printed wiring board applications

Available to Purchase
Bernd Hoevel, Ludovic Valette, Joseph Gan
Journal: Circuit World
Circuit World (2007) 33 (2): 17–27.
https://doi.org/10.1108/03056120710750229
Published: 22 May 2007
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Journal Articles

Influence of the binder system on current and future demands for base materials

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Bernd Hoevel, Ludovic Valette, Tomoyuki Aoyama
Journal: Circuit World
Circuit World (2006) 32 (4): 9–14.
https://doi.org/10.1108/03056120610683559
Published: 01 December 2006
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Journal Articles

High‐performance substrate from new epoxy resin and enhanced copper foil

Available to Purchase
Ludovic Valette, Rudolf Wiechmann
Journal: Circuit World
Circuit World (2004) 30 (4): 20–26.
https://doi.org/10.1108/03056120410539876
Published: 01 December 2004
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