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Journal Articles

Solder failure mechanisms in single‐sided insertion‐mount printed wiring boards

C. Hillman, K. Rogers, A. Dasgupta, M. Pecht, R. Dusek, B. Lorence
Journal: Circuit World
Circuit World (1999) 25 (3): 28–38.
https://doi.org/10.1108/03056129910269025
Published: 01 September 1999
View article titled, Solder failure mechanisms in single‐sided insertion‐mount printed wiring boards
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Journal Articles

In situ temperature measurements of PQFPs during infrared reflow

M. Dube, T.J. Dishongh, K.E. Beatty, M. Pecht
Journal: Circuit World
Circuit World (1998) 24 (4): 29–32.
https://doi.org/10.1108/03056129810223945
Published: 01 December 1998
View article titled, In situ temperature measurements of PQFPs during infrared reflow
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Journal Articles

Plastic‐encapsulated Microcircuits (PEMs) : Long‐term Dormancy Studies

E.B. Hakim, J. Fink, S.M. Tam, P. McCluskey, M. Pecht
Journal: Circuit World
Circuit World (1997) 23 (4): 26–29.
https://doi.org/10.1108/03056129710370286
Published: 01 December 1997
View article titled, Plastic‐encapsulated Microcircuits (PEMs) : Long‐term Dormancy Studies
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Journal Articles

Effect of Delamination on Moisture Accelerated Failures in Plastic Encapsulated Microcircuits

M. Pecht, Y. Ranade, J. Pecht
Journal: Circuit World
Circuit World (1997) 23 (4): 11–15.
https://doi.org/10.1108/03056129710370259
Published: 01 December 1997
View article titled, Effect of Delamination on Moisture Accelerated Failures in Plastic Encapsulated Microcircuits
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Journal Articles

Recent Developments in Taiwan’s Electronics Industry

C.S. Lee, M. Pecht
Journal: Circuit World
Circuit World (1997) 23 (3): 16–19.
https://doi.org/10.1108/03056129710370204
Published: 01 September 1997
View article titled, Recent Developments in Taiwan’s Electronics Industry
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Journal Articles

Hollow Fibres in PCB, MCM‐L and PBGA Laminates May Induce Reliability Degradation

A. Shukla, M. Pecht, J. Jordan, K. Rogers, D. Jennings*
Journal: Circuit World
Circuit World (1997) 23 (2): 5–6.
https://doi.org/10.1108/03056129710800116
Published: 01 June 1997
View article titled, Hollow Fibres in PCB, MCM‐L and PBGA Laminates May Induce Reliability Degradation
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Journal Articles

Electrochemical Migration in Multichip Modules

B. Rudra, M.J. Li, M. Pecht, D. Jennings
Journal: Circuit World
Circuit World (1996) 22 (1): 67–70.
https://doi.org/10.1108/03056129610799868
Published: 01 April 1996
View article titled, Electrochemical Migration in Multichip Modules
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