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Journal Articles

Characterization of the surface morphology of electroless NiP deposited on conductive Cu film

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Seok-Hwan Huh, Sung-Ho Choi, An-Seob Shin, Gi-Ho Jeong, Suk-Jin Ham, Keun-Soo Kim
Journal: Circuit World
Circuit World (2015) 41 (4): 137–146.
https://doi.org/10.1108/CW-01-2015-0003
Published: 02 November 2015
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Journal Articles

Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method

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Seok-Hwan Huh, Kang-Dong Kim, Keun-Soo Kim
Journal: Circuit World
Circuit World (2014) 40 (2): 71–78.
https://doi.org/10.1108/CW-12-2013-0050
Published: 29 April 2014
View article titled, Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method
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