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Journal Articles

Finite element modeling to analyze durability of BGA/CSP connections during thermal shock

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Subhotosh Khan, Dan J. Molligan
Journal: Circuit World
Circuit World (2001) 27 (4): 8–12.
https://doi.org/10.1108/03056120110695777
Published: 01 December 2001
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Journal Articles

Comparison of the dielectric constant and dissipation factors of non‐woven aramid/FR4 and glass/FR4 laminates

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Subhotosh Khan
Journal: Circuit World
Circuit World (2000) 26 (2): 33–37.
https://doi.org/10.1108/03056120010310909
Published: 01 June 2000
View article titled, Comparison of the dielectric constant and dissipation factors of non‐woven aramid/FR4 and glass/FR4 laminates
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