Page 1 | Search Results | Circuit World

1-5 of 5

Sort by

Sort Order Select

Journal Articles

Discrete Wiring: A Systems Approach To High Speed Design Problems

T.J. Buck

Circuit World (1997) 23 (1): 9–15.

https://doi.org/10.1108/03056129710800053

Published: 01 March 1997

View article titled, Discrete Wiring: A Systems Approach To High Speed Design Problems

Add to Citation Manager for Discrete Wiring: A Systems Approach To High Speed Design Problems

Journal Articles

High Density Flex‐rigid Circuits — A Solution for Board‐to‐board Transmission Line Interconnects

T.J. Buck

Circuit World (1993) 19 (4): 21–27.

https://doi.org/10.1108/eb046222

Published: 01 March 1993

View article titled, High Density Flex‐rigid Circuits — A Solution for Board‐to‐board Transmission Line Interconnects

Add to Citation Manager for High Density Flex‐rigid Circuits — A Solution for Board‐to‐board Transmission Line Interconnects

Journal Articles

Advanced Metal Core Substrates as a Solution for Multichip Module Backplanes

T.J. Buck

Circuit World (1992) 18 (2): 20–26.

https://doi.org/10.1108/eb046155

Published: 01 January 1992

View article titled, Advanced Metal Core Substrates as a Solution for Multichip Module Backplanes

Add to Citation Manager for Advanced Metal Core Substrates as a Solution for Multichip Module Backplanes

Journal Articles

Interconnection Techniques for GaAs Packaging

T.J. Buck

Circuit World (1991) 18 (1): 22–33.

https://doi.org/10.1108/eb046151

Published: 01 April 1991

View article titled, Interconnection Techniques for GaAs Packaging

Add to Citation Manager for Interconnection Techniques for GaAs Packaging

Journal Articles

Advanced Discrete Wiring Technology: A Solution for High Density Sub‐nanosecond Interconnection

T.J. Buck

Circuit World (1988) 14 (2): 4–10.

https://doi.org/10.1108/eb043946

Published: 01 January 1988

View article titled, Advanced Discrete Wiring Technology: A Solution for High Density Sub‐nanosecond Interconnection

Add to Citation Manager for Advanced Discrete Wiring Technology: A Solution for High Density Sub‐nanosecond Interconnection

Update search

NARROW

Format

Journal

Type

Date

Availability

Discrete Wiring: A Systems Approach To High Speed Design Problems

High Density Flex‐rigid Circuits — A Solution for Board‐to‐board Transmission Line Interconnects

Advanced Metal Core Substrates as a Solution for Multichip Module Backplanes

Interconnection Techniques for GaAs Packaging

Advanced Discrete Wiring Technology: A Solution for High Density Sub‐nanosecond Interconnection

Email alerts