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Thermal stability analysis of passive components embedded into printed circuit boards

Wojciech Stęplewski, Andrzej Dziedzic, Kamil Janeczek, Aneta Araźna, Krzysztof Lipiec, Janusz Borecki, Tomasz Serzysko

Circuit World (2018) 44 (1): 29–36.

https://doi.org/10.1108/CW-10-2017-0057

Published: 02 February 2018

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Journal Articles

Assessment of stability and reliability of embedded components in printed circuit boards

Wojciech Steplewski, Andrzej Dziedzic, Janusz Borecki, Tomasz Serzysko

Circuit World (2017) 43 (1): 19–26.

https://doi.org/10.1108/CW-11-2016-0056

Published: 06 February 2017

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Journal Articles

Application of direct bonded copper substrates for prototyping of power electronic modules

Wojciech Grzesiak, Piotr Maćków, Tomasz Maj, Beata Synkiewicz, Krzysztof Witek, Ryszard Kisiel, Marcin Myśliwiec, Janusz Borecki, Tomasz Serzysko, Marek Żupnik

Circuit World (2016) 42 (1): 23–31.

https://doi.org/10.1108/CW-10-2015-0051

Published: 01 February 2016

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Journal Articles

Reactance components embedded in printed circuit boards

Wojciech Stęplewski, Andrzej Dziedzic, Adam Kłossowicz, Paweł Winiarski, Janusz Borecki, Grażyna Kozioł, Tomasz Serzysko

Circuit World (2015) 41 (3): 125–132.

https://doi.org/10.1108/CW-03-2015-0009

Published: 03 August 2015

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Journal Articles

Environmental tests of embedded thin- and thick-film resistors in comparison to chip resistors

Wojciech Steplewski, Andrzej Dziedzic, Janusz Borecki, Grazyna Koziol, Tomasz Serzysko

Circuit World (2014) 40 (1): 7–12.

https://doi.org/10.1108/CW-10-2013-0039

Published: 28 January 2014

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Journal Articles

Thermal effects in embedded thin- and thick-film resistors in comparison to chip resistors

Wojciech Steplewski, Andrzej Dziedzic, Janusz Borecki, Grazyna Koziol, Tomasz Serzysko

Circuit World (2014) 40 (1): 27–32.

https://doi.org/10.1108/CW-10-2013-0040

Published: 28 January 2014

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Thermal stability analysis of passive components embedded into printed circuit boards

Assessment of stability and reliability of embedded components in printed circuit boards

Application of direct bonded copper substrates for prototyping of power electronic modules

Reactance components embedded in printed circuit boards

Environmental tests of embedded thin- and thick-film resistors in comparison to chip resistors

Thermal effects in embedded thin- and thick-film resistors in comparison to chip resistors

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