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Journal Articles

A modified model of conductor roughness for manufacturing copper lines of printedcircuit board

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Chong Wang, Yingjie Wang, Kegu Adi, Yunzhong Huang, Yuanming Chen, Shouxu Wang, Wei He, Yao Tang, Yukai Sun, Weihua Zhang, Chenggang Xu, Xuemei He
Journal: Circuit World
Circuit World (2022) 48 (4): 493–501.
https://doi.org/10.1108/CW-10-2019-0144
Published: 12 August 2021
View article titled, A modified model of conductor roughness for manufacturing copper lines of printedcircuit board
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Journal Articles

Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching

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Denglin Fu, Yanan Wen, Jida Chen, Lansi Lu, Ting Yan, Chaohui Liao, Wei He, Shijin Chen, Lizhao Sheng
Journal: Circuit World
Circuit World (2023) 49 (1): 1–12.
https://doi.org/10.1108/CW-05-2019-0047
Published: 03 August 2021
View article titled, Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching
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Journal Articles

Numerical simulation and experiments to improve throwing power for practical PCB through-holes plating

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Jing Xiang, Chong Wang, Yuanming Chen, Feng Xia, Wei He, Hua Miao, Jinqun Zhou, Qingguo Chen, Xiaofeng Jin
Journal: Circuit World
Circuit World (2019) 45 (4): 221–230.
https://doi.org/10.1108/CW-05-2018-0033
Published: 16 October 2019
View article titled, Numerical simulation and experiments to improve throwing power for practical PCB through-holes plating
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Journal Articles

Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation

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Jing Xiang, Yuanming Chen, Shouxu Wang, Chong Wang, Wei He, Huaiwu Zhang, Xiaofeng Jin, Qingguo Chen, Xinhong Su
Journal: Circuit World
Circuit World (2018) 44 (3): 150–160.
https://doi.org/10.1108/CW-12-2017-0078
Published: 10 July 2018
View article titled, Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation
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Journal Articles

Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process

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Shouxu Wang, Xiaolan Xu, Guoyun Zhou, Yuanming Chen, Wei He, Wenjun Yang, Xinhong Su, Yongshuan Hu
Journal: Circuit World
Circuit World (2018) 44 (2): 53–59.
https://doi.org/10.1108/CW-11-2017-0064
Published: 12 April 2018
View article titled, Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process
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Journal Articles

Mechanism analysis of microvia filling based on multiphysics coupling

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Linxian Ji, Shidong Su, Hexian Nie, Shouxu Wang, Wei He, Kehua Ai, Qinghua Li
Journal: Circuit World
Circuit World (2018) 44 (2): 60–68.
https://doi.org/10.1108/CW-06-2017-0029
Published: 15 January 2018
View article titled, Mechanism analysis of microvia filling based on multiphysics coupling
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Journal Articles

Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method

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Huirong He, Jida Chen, Shengtao Zhang, Minhui Liao, Lingxing Li, Wei He, Yuanming Chen, Shijin Chen
Journal: Circuit World
Circuit World (2017) 43 (3): 131–138.
https://doi.org/10.1108/CW-02-2017-0004
Published: 07 August 2017
View article titled, Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method
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Journal Articles

Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer structures of backboard for press-fit application

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Shouxu Wang, Ting Yang, Yuanming Chen, Wei He, Yongsuan Hu, Xinhong Su
Journal: Circuit World
Circuit World (2016) 42 (3): 104–109.
https://doi.org/10.1108/CW-06-2015-0027
Published: 01 August 2016
View article titled, Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer structures of backboard for press-fit application
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Journal Articles

A copper electroplating formula for BVHs and THs filling at one process

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Jia Liu, Jida Chen, Zhu Zhang, Jiali Yang, Wei He, Shijin Chen
Journal: Circuit World
Circuit World (2016) 42 (3): 141–151.
https://doi.org/10.1108/CW-10-2015-0049
Published: 01 August 2016
View article titled, A copper electroplating formula for BVHs and THs filling at one process
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Journal Articles

Multi-physics coupling aid uniformity improvement in pattern plating

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Linxian Ji, Chong Wang, Shouxu Wang, Kai Zhu, Wei He, Dingjun Xiao
Journal: Circuit World
Circuit World (2016) 42 (2): 69–76.
https://doi.org/10.1108/CW-05-2015-0023
Published: 03 May 2016
View article titled, Multi-physics coupling aid uniformity improvement in pattern plating
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Journal Articles

Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability

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Yuanming Chen, Shouxu Wang, Xuemei He, Wei He, Vadim V. Silberschmidt, Ze Tan
Journal: Circuit World
Circuit World (2015) 41 (2): 55–60.
https://doi.org/10.1108/CW-11-2014-0052
Published: 05 May 2015
View article titled, Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability
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Journal Articles

Multiphysics coupling simulation of RDE for PCB manufacturing

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Linxian Ji, Chong Wang, Shouxu Wang, Wei He, Dingjun Xiao, Ze Tan
Journal: Circuit World
Circuit World (2015) 41 (1): 20–28.
https://doi.org/10.1108/CW-09-2014-0037
Published: 02 February 2015
View article titled, Multiphysics coupling simulation of RDE for PCB manufacturing
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Journal Articles

Study on process technique of PCBs with ladder conductive lines

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Xiaowei Li, Jia Liu, Shengtao Zhang, Wei He, Shijin Chen, Zhidan Li, Jida Chen
Journal: Circuit World
Circuit World (2015) 41 (1): 34–40.
https://doi.org/10.1108/CW-09-2014-0036
Published: 02 February 2015
View article titled, Study on process technique of PCBs with ladder conductive lines
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Journal Articles

Preparation of electronic-grade CuO for copper electrodeposition of printed circuit boards

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Jianhui Lin, Chong Wang, Yuanming Chen, Wei He, Dingjun Xiao, Ze Tan
Journal: Circuit World
Circuit World (2014) 40 (4): 127–133.
https://doi.org/10.1108/CW-07-2014-0031
Published: 28 October 2014
View article titled, Preparation of electronic-grade CuO for copper electrodeposition of printed circuit boards
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Journal Articles

UV laser cutting of glass-epoxy material for opening flexible areas of rigid-flex PCB

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Shouxu Wang, Li Feng, Yuanming Chen, Wei He, Zhihua Tao, Shijing Chen, Huan Xu
Journal: Circuit World
Circuit World (2014) 40 (3): 85–91.
https://doi.org/10.1108/CW-05-2014-0020
Published: 29 July 2014
View article titled, UV laser cutting of glass-epoxy material for opening flexible areas of rigid-flex PCB
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Journal Articles

Effects of MnSO4 on microstructure and electrical resistance properties of electroless Ni−P thin-films and its application in embedded resistor inside PCB

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Guoyun Zhou, Chia-Yun Chen, Liyi Li, Zhihua Tao, Wei He, C.P. Wong
Journal: Circuit World
Circuit World (2014) 40 (2): 45–52.
https://doi.org/10.1108/CW-08-2013-0030
Published: 29 April 2014
View article titled, Effects of MnSO4 on microstructure and electrical resistance properties of electroless Ni−P thin-films and its application in embedded resistor inside PCB
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Journal Articles

Failure mechanism of solder bubbles in PCB vias during high‐temperature assembly

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Yuanming Chen, Wei He, Guoyun Zhou, Zhihua Tao, Yang Wang, Daojun Luo
Journal: Circuit World
Circuit World (2013) 39 (3): 133–138.
https://doi.org/10.1108/CW-02-2013-0004
Published: 16 August 2013
View article titled, Failure mechanism of solder bubbles in PCB vias during high‐temperature assembly
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