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Journal Articles

A modified model of conductor roughness for manufacturing copper lines of printedcircuit board

Chong Wang, Yingjie Wang, Kegu Adi, Yunzhong Huang, Yuanming Chen, Shouxu Wang, Wei He, Yao Tang, Yukai Sun, Weihua Zhang, Chenggang Xu, Xuemei He

Circuit World (2022) 48 (4): 493–501.

https://doi.org/10.1108/CW-10-2019-0144

Published: 12 August 2021

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Journal Articles

Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability

Yuanming Chen, Shouxu Wang, Xuemei He, Wei He, Vadim V. Silberschmidt, Ze Tan

Circuit World (2015) 41 (2): 55–60.

https://doi.org/10.1108/CW-11-2014-0052

Published: 05 May 2015

View article titled, Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability

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