Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Date
Availability
1-2 of 2
Keywords: ASPIS
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
PCB failure analysis related to the ENIG black pad problem
Available to Purchase
Journal:
Circuit World
Circuit World (2013) 39 (3): 124–132.
Published: 16 August 2013
...Rimantas Ramanauskas; Algirdas Selskis; Jurga Juodkazyte; Vitalija Jasulaitiene Purpose The purpose of this paper is to verify the principal conclusions, done during the implementation of FP7 ASPIS project objectives in fundamental research of ENIG‐related failures by investigating real...
Journal Articles
Advanced surface protection for improved reliability PCB systems (ASPIS)
Available to PurchaseAndy Ballantyne, Greg Forrest, Martin Goosey, Asta Griguceviciene, Jurga Juodkazyte, Rod Kellner, Aleksandr Kosenko, Rimantas Ramanauskas, Karl Ryder, Algirdas Selskis, Rima Tarozaite, Erik Veninga
Journal:
Circuit World
Circuit World (2012) 38 (1): 21–29.
Published: 03 February 2012
... ASPIS project that is undertaking a multi‐faceted approach to develop novel and improved nickel‐gold (ENIG) solderable finish chemistries and processes in order to overcome issues such as “black pad” that are known to cause reliability issues. Design/methodology/approach The ASPIS project has four...
