...Michael J. Mullins; David K. Luttrull; Hans Schumacher Purpose Boric acid has been used for many years as a catalyst inhibitor and crosslinking agent to increase the glass transition temperature of epoxy resins for printed circuit boards (PCB), as well as in the glass fibre reinforcement. Recent...

... is the established RA in the electroless copper metallization process used with plated through‐holes. Because of its environmental impact, there is a need to replace formaldehyde. In this investigation, the more environmentally friendly glyoxylic acid is used as an autocatalytic RA. However, glyoxylic acid is more...

... increasingly used for electrochemical processes without too much attention to possible side‐effects. The purpose of this paper is, therefore, to review the types of commercially available catalytic anodes and their electrochemical properties, particularly with respect to acid copper electroplating. Design...

...Narinder Bains; Martin Goosey; Runveer Hayer Ethylene diamine tetra‐acetic acid (EDTA) and other chelates are widely employed in the electroless copper plating solutions and related chemistries used in printed circuit board (PCB) manufacturing. EDTA in particular, imparts many benefits...

...G.K.K. Poon Sequential application of fractional factorial and response surface designs in the regression modelling and optimisation of a multi‐parameter type manufacturing process is presented. In particular, the coating thickness variation of an acid copper plating process was minimised with high...