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Keywords: Activation energy
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Journal Articles
Journal:
Circuit World
Circuit World (2015) 41 (4): 137–146.
Published: 02 November 2015
... the deposition rate and activation energy of electroless NiP deposits on the non-catalytic Cu film at various deposition times (60, 120, 240 and 480 s) and temperatures (70, 80 and 90°C) at pH 4.6. Design/methodology/approach – Specimens with and without Pd catalyst on Cu film were prepared as follows...
