... can be realized at lower temperature and decreased pressure than sintering process. Research limitations/implications For SLID technology, the adhesion between Cu-backside covered HEMT die and DBC with Sn layer loses its operational properties after short-term ageing in air at temperature of 300°C...

... sheet resistance than Ink (A) because of its lower silver particle content but also because of the shorter curing time and lower curing temperature. Ink (A) showed excellent adhesion on PET, and Ink (B) had moderate adhesion on PET without corona or plasma pre-treatments, but both inks adhered weakly...

... peroxide-sulfuric pre-treatment of electroformed copper patterns before hot press bonding clearly improved the adhesion of copper on both acrylonitrile butadiene styrene and polyphenylene oxide substrates and that a steel template around the substrate during hot pressing process can restrict dimensional...

... 370 HR). The efficiency of the sonochemical surface modification process was determined by weight loss, roughness, adhesion and scanning electron microscopy (SEM). Findings This study has confirmed that ultrasound has the ability to surface modify a high Tg epoxy substrate material (Isola 370 HR...

...Teija Laine‐Ma; Pekka Ruuskanen; Satu Kortet; Mikko Karttunen Purpose The adhesion between electroless copper and a substrate is one of the most important factors in the reliability of thermoplastic printed circuit boards. The purpose of this paper is to investigate the effects of mechanical...

... Using the new 3D‐MID multilayer process a 3D demonstrator with three metallization layers is fabricated. Injection molding simulation is utilized to ensure a feasible demonstrator design. It is shown that a surface laser treatment improves layer‐to‐layer adhesion during the process. Shear and pull tests...

... substrates. When the “LDk‐HTd” resin is used in combination with the JTCHTEAB copper foil, the copper peel strength fully meets the industry standard for high T_g FR‐4 laminates. © Emerald Group Publishing Limited 2004 Epoxy resins Adhesion Thermal stability FR‐4...

...′ and E′′), coefficients of thermal expansion (CTE), and apparent strengths of adhesion (ASA). In addition, reliability tests were conducted, and several promising materials were identified. The ASA of the encapsulant to the die passivation and the printed circuit board (PCB) is critical to the robustness...