Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Issue Section
Date
Availability
1-4 of 4
Keywords: Ball grid array
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Circuit World
Circuit World (2001) 27 (4): 8–12.
Published: 01 December 2001
... Finite element modelling Durability Ball grid array Chip scale packaging Thermal stress Miniaturized boards with high density interconnects (HDI) employ ball grid array (BGA) connections and chip scale packages (CSP) to conserve real estate. However, these boards then become a complex...
Journal Articles
Journal:
Circuit World
Circuit World (1999) 25 (4)
Published: 01 December 1999
... © MCB UP Limited 1999 --> Lloyd Doyle Automatic optical inspection Ball grid array AOI for BGA carriers Keywords: Lloyd Doyle, Automatic optical inspection, Ball grid array Lloyd Doyle have recently introduced the EXCALIBUR 5000X2 BGA Automatic...
Journal Articles
Journal:
Circuit World
Circuit World (1999) 25 (2): 31–34.
Published: 01 June 1999
...Larry W. Burgess; Fabrizio Pauri Ball grid array (BGA) component packages challenge the circuit board design with signal routing and layout, creating in some cases extra board layers and added vias all resulting in increased costs for the printed circuit board (PCB). As component densities increase...
Journal Articles
Journal:
Circuit World
Circuit World (1996) 22 (3): 10–15.
Published: 01 December 1996
...R.D. Schueller; A.P. Plepys Tape ball grid array (TBGA) packages offer many of the advantages of plastic BGAs, namely excellent durability, improved board space utilisation and ease of surface mount assembly along with the associated yield improvements. TBGA packages go a step further, however...
