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1-11 of 11
Keywords: Capacitors
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Journal Articles
Printable electronics: towards materials development and device fabrication
Available to Purchase
Journal:
Circuit World
Circuit World (2011) 37 (1): 38–45.
Published: 08 February 2011
... materials, etc. Materials can provide high‐capacitance densities, ranging from 5 to 25 nF/in2, depending on composition, particle size, and film thickness. The electrical properties of capacitors fabricated from BaTiO3‐epoxy nanocomposites showed a stable dielectric constant and low...
Journal Articles
Laser processing of materials: a new strategy toward materials design and fabrication for electronic packaging
Available to Purchase
Journal:
Circuit World
Circuit World (2010) 36 (2): 24–32.
Published: 18 May 2010
..., the laser was used to generate free‐standing nano and micro particles from thin film surfaces. In the case of BaTiO3 polymer‐based nanocomposites, micromachining is used to generate arrays of variable‐thickness capacitors. The resultant thickness of the capacitors depends on the number of laser...
Journal Articles
Effectiveness of embedded capacitors in reducing the number of surface mount capacitors for decoupling applications
Available to Purchase
Journal:
Circuit World
Circuit World (2010) 36 (1): 22–30.
Published: 09 February 2010
...Mohammed A. Alam; Michael H. Azarian; Michael Osterman; Michael Pecht Purpose The purpose of this paper is to present an analytical approach to find the reduction in the required number of surface mount capacitors by the use of embedded capacitors in decoupling applications. Design/methodology...
Journal Articles
Resin coated copper capacitive (RC3) nanocomposites for multilayer embedded capacitors: towards system in a package (SiP)
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Journal:
Circuit World
Circuit World (2009) 35 (4): 31–39.
Published: 20 November 2009
... technology based on ferroelectric‐epoxy polymer‐based flake‐free resin coated copper capacitive (RC3) nanocomposites to manufacture multilayer embedded capacitors. Design/methodology/approach This paper discusses thin film technology based on RC3 nanocomposites. In particular, recent developments in high...
Journal Articles
Low‐power noise multilayer PCB with discrete decoupling capacitors inside
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Journal:
Circuit World
Circuit World (2009) 35 (2): 30–36.
Published: 15 May 2009
...Ki‐Jae Song; Jongmin Kim; Jongwoon Yoo; Wansoo Nah; Jaeil Lee; Hyunseop Sim Purpose The purpose of this paper is to present the power noise characteristics of a multilayer printed circuit board (PCB) in which discrete capacitors have been embedded. Design/methodology/approach Embedded...
Journal Articles
Prognostics of ceramic capacitor temperature‐humidity‐bias reliability using Mahalanobis distance analysis
Available to Purchase
Journal:
Circuit World
Circuit World (2007) 33 (3): 21–28.
Published: 28 August 2007
...Lei Nie; Michael H. Azarian; Mohammadreza Keimasi; Michael Pecht Purpose This paper seeks to present a prognostics approach using the Mahalanobis distance (MD) method to predict the reliability of multilayer ceramic capacitors (MLCCs) in temperature‐humidity‐bias (THB) conditions. Design...
Journal Articles
Design considerations for thin‐film embedded resistor and capacitor technologies
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Journal:
Circuit World
Circuit World (2005) 31 (1): 21–27.
Published: 01 March 2005
... resistors, and the trade‐offs between resistor size, tolerance, and capability of board fabrication processes, are analyzed in detail. This paper also discusses selection of the appropriate embedded capacitor technology and introduces some initial results on Rohm and Haas's thin‐film, high...
Journal Articles
Process development for PWB compatible embedded capacitors
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Journal:
Circuit World
Circuit World (2004) 30 (1): 31–35.
Published: 01 March 2004
...Swapan K. Bhattacharya; P. Markondeya Raj; Devarajan Balaraman; Hitesh Windlass; Rao R. Tummala This paper addresses materials and processes for printed wiring board compatible embedded capacitors using polymer/ceramic nanocomposites and hydrothermal barium titanate. Polymers allow low temperature...
Journal Articles
Matching embedded capacitor dielectrics to applications
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Journal:
Circuit World
Circuit World (2004) 30 (1): 20–24.
Published: 01 March 2004
...Richard Ulrich All capacitor dielectric materials, whether used for discrete or embedded applications, can be grouped into two general categories: paraelectric and ferroelectric. Ferroelectrics generally exhibit much higher dielectric constants, but are also less stable with regard to temperature...
Journal Articles
Thin‐film embedded resistor and capacitor technologies
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Journal:
Circuit World
Circuit World (2004) 30 (1): 16–19.
Published: 01 March 2004
... measured data on resistance values, uniformity, and thermal effects, and their impact on design rules for resistor size. Preliminary results of Shipley's thin‐film embedded capacitor technology with high capacitance densities (10 and 200 nF/cm2) are also presented. © Emerald Group Publishing...
Journal Articles
New non‐reinforced substrates for use as embedded capacitors
Available to Purchase
Journal:
Circuit World
Circuit World (2004) 30 (1): 36–41.
Published: 01 March 2004
... are increasingly embedding capacitive layers in the PCB. The majority of the products in use utilize reinforced epoxy laminates. These products are relatively easy to handle, but the thickness and Dk limit the effectiveness of the layer to perform as a capacitor. Other materials are being developed...
