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1-4 of 4
Keywords: Chip scale packaging
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Journal Articles
Journal:
Circuit World
Circuit World (2004) 30 (2)
Published: 01 June 2004
... © Emerald Group Publishing Limited 2004 --> Chip scale packaging Chip Scale Packaging for Modern Electronics Joseph Fjelstad, Reza Ghaffarian and Young-Gon KimElectrochemical Publications Keywords: Chip scale packaging This is only the second book...
Journal Articles
Journal:
Circuit World
Circuit World (2001) 27 (4): 8–12.
Published: 01 December 2001
... Finite element modelling Durability Ball grid array Chip scale packaging Thermal stress Miniaturized boards with high density interconnects (HDI) employ ball grid array (BGA) connections and chip scale packages (CSP) to conserve real estate. However, these boards then become a complex...
Journal Articles
Journal:
Circuit World
Circuit World (2001) 27 (1): 20–31.
Published: 01 March 2001
...John H. Lau The solder‐joint reliability of solder‐bumped wafer level chip scale package (WLCSP) on microvia build‐up printed circuit board (PCB) subjected to thermal cycling conditions is investigated in this study. The 62Sn36Pb2Ag solder joints are assumed to be: an elastic material; an elastic...
Journal Articles
Journal:
Circuit World
Circuit World (2000) 26 (3): 6–10.
Published: 01 September 2000
... technology will be introduced at the PCB level. At this time we are also able to transfer the chip design into the PCB directly. This dependence of the development from chip‐ and PCB‐technology is the subject of the paper. Chip scale packages are expected to have an even stronger percent growth due...
