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Keywords: Computer components
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Journal Articles
Journal:
Circuit World
Circuit World (2012) 38 (1): 4–11.
Published: 03 February 2012
... point of it, it was simply a fact. (That said, the technique was applied to chips in some development projects in the 1980s and 1990s by TI and others). Electronics industry Microprocessor chips Computer components Silicon 3D interconnections Stacked chip packages Through silicon via (TSV...
