... Publishing Limited 2017 Emerald Publishing Limited Licensed re-use rights only Solder flux residues can be considered the major source of ionic contamination on the manufactured PCBAs, and their corrosiveness is determined by the activator type in the flux (Sohn and Ray, 1994 ; Smith and Turbini...

... in the solder layer during the soldering process. The results of PCB B analysis confirmed the authors' observation that Au layers deposited on EN substrate from IG solution contaminated with Cu ions are highly porous and loosely adhering to EN coating, which, in addition, undergoes serious corrosion damages...

... of the fractured layer between the Ni₃P and Ni₃Sn₄ inter‐metallic compound, confirming the presence of Black Pad. Findings Grain boundaries or “mud‐cracks” that can be clearly seen in a top view of the failed pad surface and corrosion spikes in the failed pad surface...

...George Milad Purpose The purpose of this paper is to present a better understanding of nickel corrosion, also known as “black pad” during gold deposition of EN1G. Design/methodology/approach This paper presents an accumulation of personal experience and observations of the problem over...