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Keywords: Curing degree
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Journal Articles
Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method
Available to Purchase
Journal:
Circuit World
Circuit World (2014) 40 (2): 71–78.
Published: 29 April 2014
.... Design/methodology/approach – In this study, the effects of surface morphology on the adhesion strength were studied for a Cu/epoxy resin system using a SAICAS. In order to evaluate the peel strength of the sample, the curing degree and surface morphology of the epoxy resin were varied in the Cu/epoxy...
