...Mark Andrew Ashworth; Barrie Dunn Purpose This paper aims to present the results of a 32-year-old laboratory study of whisker growth from tin electrodeposits that was originally undertaken to gain an increased understanding of the phenomenon of tin whisker growth. Design/methodology/approach...

... Electrodeposition Flip‐chip assembly technologies have been established as a main area of interest in electronics packaging for the production of small and lightweight electronic devices. This rapid increase in the application of flip‐chip technology is due to the rise in portable electronic products...

... with the substrate. EnFACE uses a single step to transfer patterns by optimising reactor geometry, electrochemistry and engineering parameters and pattern transfer is achieved without contact between the two electrodes. © Emerald Group Publishing Limited 2009 Electrodeposition Copper Printed...

... to oxidation of organic species in electroplating solutions. This in turn can lead to loss of control and additional costs for additives in electrodeposition. This study has addressed the issue and the paper attempts to set down some data‐based rules for the selection process. It also discusses some ways...

... to enable it to be realised on more extreme non‐planar substrates. © Emerald Group Publishing Limited 2005 Packaging Electrodeposition Circuits Ink jet printers Photolithography is the basic technique by which patterns are transferred onto printed circuit boards (PCBs...

... holes formed by CO₂ laser ablation were used as test samples for filling plating. The tested boards for copper electrodeposition were approximately 6×10 cm² in area. The via‐hole sizes were from ca. 65 to 110 μm and two types of via‐hole depths (i.e. ca. 55 and 100...

... ; the absolute values of the whisker grades are much higher, indicating the severity with stamped lead frames © Emerald Group Publishing Limited 2004 Semiconductors Alloys Electrodeposition With the date for the introduction of legislation (RHS Directive, 2003 ; WEEE Directive, 2003...

... are discussed. Electrodeposition has been used to apply photo resists in the PWB industry for approximately 20 years (Nakahara, 1992). A unique advantage of electro‐deposition is its ability to deposit a uniform film of resist on three‐dimensional surfaces. This trait make ED resists well suited...

...H.D. Merchant; J.T. Wang; L.A. Giannuzzi; Y.L. Liu In this paper, we consider intrinsic properties of copper electrodeposited as plateup on polyimide substrate, thermal response of electrodeposited copper and fatigue performance of copper and copper/polyimide construction. The critical material...

... Electrochemical introduce three new products Keywords: Electrochemical, Electrodeposition, Solvents, Solder masks Electro-Brite PC-671 is a specialty chemical additive for acid copper deposition. The process is designed to produce superior levelling and eliminate plating nodules...

... © MCB UP Limited 2000 --> Enthone-OMI Seniconductors Electrodeposition Keywords Enthone-OMI, Seniconductors, Electrodeposition Enthone-OMI Inc. recently completed the construction of a high volume manufacturing facility for its semiconductor grade, high purity copper...