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Journal Articles

A novel flip‐chip interconnection process for integrated circuits

Mark W. Sugden, David A. Hutt, David C. Whalley, Changqing Liu

Circuit World (2012) 38 (4): 214–218.

https://doi.org/10.1108/03056121211280422

Published: 16 November 2012

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Journal Articles

Solderability of electroless deposited Ni‐P coatings with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solder alloys

Dezhi Li, Changqing Liu, Paul P. Conway

Circuit World (2005) 31 (3): 32–39.

https://doi.org/10.1108/03056120510585054

Published: 01 September 2005

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Journal Articles

Surface coatings for fluxless soldering of copper

Changqing Liu, David A. Hutt

Circuit World (2003) 29 (1): 19–23.

https://doi.org/10.1108/03056120310444151

Published: 01 March 2003

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