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Journal Articles

Integrated in‐plane mirror and multimode waveguide fabrication using 248 nm excimer laser ablation for optical interconnects on PCBs

Shefiu S. Zakariyah, Paul P. Conway, David A. Hutt, Navin Suyal, David R. Selviah

Circuit World (2012) 38 (2): 59–63.

https://doi.org/10.1108/03056121211222255

Published: 11 May 2012

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Journal Articles

A multi‐electrode array (MEA) biochip with excimer laser‐produced micro‐well features

Olivia M. Flaherty, Xiaoyun Cui, Divya Rajamohan, David Hutt, Chris Denning, Paul P. Conway, Andrew A. West

Circuit World (2012) 38 (1): 30–37.

https://doi.org/10.1108/03056121211195030

Published: 03 February 2012

View article titled, A multi‐electrode array (MEA) biochip with excimer laser‐produced micro‐well features

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Journal Articles

Integrated optical and electronic interconnect printed circuit board manufacturing

David R. Selviah, F. Aníbal Fernández, Ioannis Papakonstantinou, Kai Wang, Hadi Bagshiahi, Andy C. Walker, Aongus McCarthy, Himanshu Suyal, David A. Hutt, Paul P. Conway, John Chappell, Shefiu S. Zakariyah, Dave Milward

Circuit World (2008) 34 (2): 21–26.

https://doi.org/10.1108/03056120810874546

Published: 16 May 2008

View article titled, Integrated optical and electronic interconnect printed circuit board manufacturing

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Journal Articles

Challenges in the manufacture of glass substrates for electrical and optical interconnect

David A. Hutt, Karen Williams, Paul P. Conway, Fuad M. Khoshnaw, Xiaoyun Cui, Deepa Bhatt

Circuit World (2007) 33 (1): 22–30.

https://doi.org/10.1108/03056120710723689

Published: 13 February 2007

View article titled, Challenges in the manufacture of glass substrates for electrical and optical interconnect

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Journal Articles

Solderability of electroless deposited Ni‐P coatings with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solder alloys

Dezhi Li, Changqing Liu, Paul P. Conway

Circuit World (2005) 31 (3): 32–39.

https://doi.org/10.1108/03056120510585054

Published: 01 September 2005

View article titled, Solderability of electroless deposited Ni‐P coatings with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solder alloys

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Integrated in‐plane mirror and multimode waveguide fabrication using 248 nm excimer laser ablation for optical interconnects on PCBs

A multi‐electrode array (MEA) biochip with excimer laser‐produced micro‐well features

Integrated optical and electronic interconnect printed circuit board manufacturing

Challenges in the manufacture of glass substrates for electrical and optical interconnect

Solderability of electroless deposited Ni‐P coatings with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solder alloys

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