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Challenges in the manufacture of glass substrates for electrical and optical interconnect

David A. Hutt, Karen Williams, Paul P. Conway, Fuad M. Khoshnaw, Xiaoyun Cui, Deepa Bhatt

Circuit World (2007) 33 (1): 22–30.

https://doi.org/10.1108/03056120710723689

Published: 13 February 2007

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